发明名称 METHOD OF HOT EMBOSSING LITHOGRAPHY
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of hot embossing lithography which can simplify operations, reduce the cost, and increase the accuracy of pattern transfer. <P>SOLUTION: In the method of hot embossing lithography, a substrate and a stamp having a predetermined pattern are provided, the stamp and the substrate are brought into contact with each other in a chamber, vapor of small molecule material is injected into the chamber, the stamp and the substrate are heated to the vitrification temperature of the substrate or higher, a pressure is applied thereon, and then the stamp and the substrate are cooled and separated from each other, so that hot embossing lithography is completed. In the present invention, strong adsorption on the interface between the stamp and the substrate is reduced by injecting the vapor of small molecule material, so that the accuracy of pattern transfer is increased, the operations are simplified, and the cost is reduced. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006148055(A) 申请公布日期 2006.06.08
申请号 JP20050202318 申请日期 2005.07.11
申请人 KOFUKIN SEIMITSU KOGYO (SHENZHEN) YUGENKOSHI;HON HAI PRECISION INDUSTRY CO LTD 发明人 YU TAI-CHERNG
分类号 H01L21/027;B29C59/02;B82B3/00 主分类号 H01L21/027
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