发明名称 |
Electroplating process and process for producing a circuit board by electroplating |
摘要 |
In an electroplating process, an electrically conductive substrate is electroplated intermittently using the substrate surface as cathode and a plating metal as anode at a constant voltage between the anode and the cathode. The electroplating process is used for producing a circuit board comprising a substrate, and as formed thereon, a conductor circuit. |
申请公布号 |
EP1667505(A1) |
申请公布日期 |
2006.06.07 |
申请号 |
EP20060003705 |
申请日期 |
1999.09.14 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
EN, HONCHIN;NAKAI, TOHRU;OKI, TAKEO;HIROSE, NAOHIRO;NODA, KOUTA |
分类号 |
H05K3/18;C23C18/34;C25D5/18;H05K1/09;H05K3/00;H05K3/10;H05K3/24;H05K3/38;H05K3/42;H05K3/46 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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