发明名称 Electroplating process and process for producing a circuit board by electroplating
摘要 In an electroplating process, an electrically conductive substrate is electroplated intermittently using the substrate surface as cathode and a plating metal as anode at a constant voltage between the anode and the cathode. The electroplating process is used for producing a circuit board comprising a substrate, and as formed thereon, a conductor circuit.
申请公布号 EP1667505(A1) 申请公布日期 2006.06.07
申请号 EP20060003705 申请日期 1999.09.14
申请人 IBIDEN CO., LTD. 发明人 EN, HONCHIN;NAKAI, TOHRU;OKI, TAKEO;HIROSE, NAOHIRO;NODA, KOUTA
分类号 H05K3/18;C23C18/34;C25D5/18;H05K1/09;H05K3/00;H05K3/10;H05K3/24;H05K3/38;H05K3/42;H05K3/46 主分类号 H05K3/18
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