发明名称 POLYIMIDE ADHESIVE COMPOSITION AND POLYIMIDE ADHESIVE TAPE
摘要 PROBLEM TO BE SOLVED: To provide a polyimide adhesive composition which excels in insulating properties and heat resistance, improves high temperature adhesion properties, and excels in adhesion properties to a coating layer of mutually different materials formed on a substrate layer, and a polyimide adhesive tape using this polyimide adhesive composition. SOLUTION: The polyimide adhesive composition is constituted of (A) a tetracarboxylic dianhydride, (B) a diamine, (C) a diamine containing a siloxane structure, (D) a polyamino compound of any one kind or in a mixed form of two or more kinds selected from the group consisting of a triamine and a tetraamine, and (E) 3,4-diaminobenzoic acid. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006124637(A) 申请公布日期 2006.05.18
申请号 JP20050093661 申请日期 2005.03.29
申请人 SAEHAN MICRONICS INC 发明人 JANG GYEONG HO;KIM GWANG MU;KWON JEONG MIN;LEE GYEONG ROK;PARK DOKU HA
分类号 C09J179/08;C09J7/02;C09J183/10 主分类号 C09J179/08
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