| 摘要 |
<p>A composition comprising (A) a silanol group-bearing silicone resin comprising 30-100 mol% of T units: R<1>-SiZ3 and among the entire T units, 30-80 mol% of T-2 units containing only one silanol group: R<1>-Si(OH)Z'2 wherein R<1> is a monovalent hydrocarbon group, Z is OH, hydrolyzable group or siloxane residue, at least one Z being a siloxane residue, and Z' is a siloxane residue, and having a number average molecular weight of at least 100, and (B) a polymer resulting from an acrylate and/or methacrylate monomer is applied to a substrate and heated above the decomposition temperature of polymer (B) to form a porous film. The porous film is flat and uniform despite porosity, and has a low permittivity and high mechanical strength. It is best suited as an interlayer insulating layer when used in semiconductor device fabrication.</p> |
