| 摘要 |
In the conventional stack module manufacturing methods, since a solder ball or a spherical metal having a Cu core is used as a connecting bump between substrates, these spherical bonding members cannot be batch-processed as paste printing. As the bonding members are required to be arranged one by one or by using an exclusive collet, the methods are troublesome, take much time, and cause product cost increase and failure product rate increase. A stack module manufacturing method is provided with a process of manufacturing a first wiring board (11) having a wiring pattern (11B) arranged on the surface and/or inside and a bump electrode (11C) which is integrated with the wiring pattern (11B) by simultaneous sintering with the wiring pattern and extends in a vertical direction, and a process of connecting the first wiring board (11) with a second wiring board (12) by stacking the first wiring board on the second wiring board (12) having a wiring pattern (12B) arranged on the surface and/or inside, through the bump electrode (11C). |
