| 摘要 |
A method for manufacturing a semiconductor light emitting device can include providing a housing having a cavity and a power feed line, a light emitting element connected to the power feed line on a bottom face of the cavity, and a wavelength conversion layer provided within the cavity and containing a wavelength conversion material. When forming the wavelength conversion layer, a first resin with little or no wavelength conversion material can be filled inside the cavity such that the light emitting element surface is slightly exposed and a surface of the first resin is formed in a bowl shape. Then, a second resin with wavelength conversion material contained therein can be filled inside the cavity over the bowl-shaped first resin. These resins can be heated to be hardened. During heating, the viscosities of the resins are reduced to cause the wavelength conversion material to migrate and deposit around the light emitting element.
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