| 摘要 |
A cooling device for radiation sources during production of a printing form includes a metallic layer for conducting an operative current and heat. The radiation sources are formed as a semiconductor substrate and are secured onto the metallic layer. An electrically insulating, heat conducting plate has an upper side to which the metallic layer is applied. A cooling body is formed of a thermally conductive material having a thermal expansion coefficient adapted to the semiconductor substrate. The heat conducting plate is secured at a lower side thereof to the cooling body. The cooling body has at least one duct for circulating a cooling fluid.
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