| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device that is applicable under high-temperature environment of 300°C or higher and to provide its manufacturing method. SOLUTION: Gold is used to connect an electrode 5 in a second substrate 4 with ends of thermoelectric elements 10 and 11 corresponding thereto, so that no solder is needed. In addition, a conductive member 6 possible to absorb the elasticity of the thermoelectric elements is provided between an electrode 13 and the other ends of the thermoelectric elements 10 and 11 in a first substrate 14 wherein no gold is used for connection, and a cover 2 is arranged outside the second substrate 4 in a manner to cover the second substrate 4. Thus, the cover 2 and the first substrate 14 are joined to give any pressure between the first substrate 14 and the second substrate 4, thereby holding the second substrate 4, the electrode 5 and the conductive member 6. COPYRIGHT: (C)2006,JPO&NCIPI
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