| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonded structure of a bonding object and a bonding member to minimize the displacement caused by the cure shrinkage of an energy-curable adhesive irrespective of the bonding form, or the like without lengthening bonding time, to enable precise alignment of parts, and to provide a bonding method and a bonding apparatus for forming the structure. SOLUTION: The bonded structure is such that a bonding object and a bonding member aligned to the bonding object are bonded to each other via an adhesion part composed of energy-curable adhesives. In this bonded structure, the bonding member has a layer using the plurality of adhesives differing in curing timing from each other, wherein the layer is divided so that the energy-curable adhesive with earlier curing timing does not bridge the bonding object and the bonding member so as not to transmit the curing shrinkage force of the energy-curable adhesives via spots in contact of the bonding object or bonding member with the energy-curable adhesives in curing the energy-curable adhesives on irradiating these adhesives with energy. COPYRIGHT: (C)2006,JPO&NCIPI
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