发明名称 |
POLISHING PAD |
摘要 |
<p>A chemical mechanical polishing apparatus has a polishing pad (30), a carrier (70) to hold a substrate (10) against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad (30) and carrier head (70) for generating relative motion therebetween. An eddy current monitoring system (40) is positioned to generate an alternating magnetic field in proximity to the substrate (10), an optical monitoring system (140) generates a light beam and detects reflections of the light beam from the substrate (10), and a controller (90) receives signals from the eddy current monitoring system (40) and the optical monitoring system (140).</p> |
申请公布号 |
EP1618991(A1) |
申请公布日期 |
2006.01.25 |
申请号 |
EP20050077315 |
申请日期 |
2001.05.18 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HANAWA, HIROJI;JOHANSSON, NILS;SWEDEK, BOGUSLAW A.;BIRANG, MANOOCHER;REDEKER, FRITZ C.;BAJAJ, RAJEEV |
分类号 |
B24B37/013;B24B37/22;B24B49/02;B24B49/12 |
主分类号 |
B24B37/013 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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