| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photoresist composition for a thick film, which has high sensitivity and preferable plating durability and is suitable as a material for forming a bump, and to provide a photoresist film and a method for forming a bump by using the film. <P>SOLUTION: The negative photoresist composition for a thick film contains (A) a novolac resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generating agent. The component (B) is a vinylmethylether polymer or a vinylethylether polymer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
