| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor encapsulation material which, with the suppressed moisture absorption, excels in storage stability and resin curability. SOLUTION: The manufacturing process of the semiconductor encapsulation material has the kneading step wherein the mixture of raw materials of the semiconductor encapsulation material is molten/kneaded to obtain a kneaded mass, the cooling step wherein the above kneaded mass is cooled to obtain a solidified product, and the pulverizing step wherein the above solidified product is pulverized to obtain a pulverent. In the process, during or after the pulverizing step, the above pulverent is brought into contact with dry air. COPYRIGHT: (C)2006,JPO&NCIPI |
