发明名称 Chip-type semiconductor device
摘要 <p>A TRIAC which is one species of chip-type semiconductors includes an element body (10) made of silicon, electrodes (11, 12) provided on one face of the element body (10), a molybdenum plate (30) provided on the electrode (12) by an alloy plate (1) made of aluminum and silicon, a molybdenum plate (31) provided on the other face of the element body (10) by a similar alloy plate (2), and nickel layers (3, 4) provided on connection faces of the molybdenum plates (30, 31) to outer electrode plates (40, 41), so that the electrode (12) and molybdenum plate (30) are firmly connected without conventional high-temperature solder which includes a great amount of lead, and that the alloy plate (1) never melt even when newly developed low-temperature institute is employed, and that the operation of the molybdenum plates (30, 31) is sufficiently realized. <IMAGE></p>
申请公布号 KR100499722(B1) 申请公布日期 2005.07.07
申请号 KR20010009747 申请日期 2001.02.26
申请人 发明人
分类号 H01L29/00;H01L23/051;H01L23/373;(IPC1-7):H01L29/00 主分类号 H01L29/00
代理机构 代理人
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