| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition, which allows a small warpage, has a good solder crack resistance, and is appropriate for sealing an area mounting type semiconductor and a semiconductor device using the same. SOLUTION: The epoxy resin composition for sealing the area mounting type semiconductor is characterized in that the weight ratio [(A)/(B)] of (A) a phenol aralkyl epoxy resin having a biphenylene skeleton to (B) a bisphenol A crystalline epoxy resin ranges from 10/90 to 90/10 and that the epoxy resin composition contains 0.01% to 1% by weight, in the entirety of the epoxy resin composition, (C) a phenol aralkyl resin having a biphenylene skeleton, (D) triaryl phosphoniophenolate, and (E) an inorganic filler that is 80% to 94% by weight in the entirety of the epoxy resin composition. The semiconductor device is characterized in that semiconductor elements are mounted on one side of a substrate and substantially only this side on the substrate surface side having the semiconductor elements mounted thereon is sealed using the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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