| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for reducing an adhesiveness of MEMS and a MEMS device coated to prevent adhesion is applied. SOLUTION: A method is provided to form a layer for preventing adhesion on a surface of a device, the method comprising the steps of carrying a coating material 24 on a cap wafer 21, and connecting the cap wafer and a MEMS wafer 41, so that both of the wafers form a hollow space, and thereafter coating at least a part of the surface of the MEMS wafer by evaporating the coating material. COPYRIGHT: (C)2005,JPO&NCIPI
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