发明名称 |
Copper plating bath and plating method |
摘要 |
An acid copper plating solution comprises copper ions, an organic acid or an inorganic acid, chloride ions, a high molecular weight surfactant that controls the electrodeposition reaction, and a sulfur-containing saturated organic compound that promotes the electrocoating rate. The high molecular weight surfactant comprises two or more types of surfactants with different hydrophobicities. The plating solution is used for forming a plating film on a conductor layer.
|
申请公布号 |
US2005072683(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
US20040816168 |
申请日期 |
2004.04.02 |
申请人 |
EBARA CORPORATION;EBARA-UDYLITE CO., LTD. |
发明人 |
NAKADA TSUTOMU;SAHODA TSUYOSHI;MISHIMA KOJI;KIMIZUKA RYOICHI;KOBAYASHI TAKESHI |
分类号 |
C25D3/38;C25D5/18;H05K3/42;(IPC1-7):C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|