ADHESIVE COMPOSITION FOR SEMICONDUCTOR PACKAGE, AND ADHESIVE SHEET AND TAPE USING THE SAME

摘要

Provided are an adhesive composition for a semiconductor device which is excellent in heat resistance, hygroscopicity resistance, adhesive strength and chemical resistance, and an adhesive sheet for a semiconductor device and an adhesive tape for a semiconductor device using the composition. The adhesive composition comprises an epoxy resin; 20-80 wt% of a carboxyl group modified acryl rubber; 0.2-20 wt% of an amino compound; and 0.2-30 wt% of a bisallylnadiimide. Preferably the content of a carboxyl group is 0.01-10 wt% in the carboxyl group modified acryl rubber; the amino compound is selected from the group consisting of diamino, triamino and tetraamino compounds having a terminal amino group; and the bisallylnadiimide is represented by the formula 1 (wherein R is a divalent group).