| 摘要 |
PROBLEM TO BE SOLVED: To improve contact performance by removing a foreign matter such as solder adhering to a contact surfaces of contact pins of a socket as it remains mounted on a substrate. SOLUTION: In a method for cleaning the socket for semiconductor devices, a plurality of the contact pins are mounted according to external terminals of a semiconductor device to be housed, and the external terminals of the semiconductor device are electrically connected to a circuit via the contact pins. A cleaning chip having parts corresponding to the external terminals of the semiconductor device to be housed as cleaning parts is housed in the socket. Adhering solder is heated, and the fuse adhering solder is made adsorbed to the cleaning parts of the cleaning chip to remove the adhering solder from the contact pins. COPYRIGHT: (C)2005,JPO&NCIPI
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