| 摘要 |
A semiconductor chip (3) is disposed in a device hole (23) of a circuit substrate (2) equipped with an insulating flexible substrate material (21). Bumps (31) of the semiconductor chip (3) are connected by single-point bonding to leads (221) protruding inside the device hole (23) from a conductor pattern (22). The circuit substrate (2) includes superposition portions (211) of the substrate material (21) superposing with the semiconductor chip (3) at four corner portions of the device hole (23), and superposition portions (212) that divide each device hole (23) into four holes (231 to 238). A dummy bump (32), which is interposed between the circuit substrate (2) and the semiconductor chip (3) and secures a predetermined gap between them, is disposed on the face of the semiconductor chip (2) superposing with these superposition portions (211, 212), without being coupled to the conductor pattern (22). A through-hole (230) for escaping air when a mold material is injected from the holes (231 to 238) is formed in the superposition portion (212). <IMAGE> |
