| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board, which can dissipate a heat generated from a mounted electronic part or the like efficiently to the outside and has excellent heat-dissipating properties. SOLUTION: In the ceramic wiring board, a plurality of insulating layers composed of ceramics are laminated, a plurality of wiring conductors 2 are formed inside and a plurality of connecting pads 3 electrically connected to the wiring conductors 2 are formed to a main surface on the lower side. In the ceramic wiring board, the wiring board has an insulating base body 1, in which through-holes 1a penetrating between upper-lower main surfaces and having stepped sections A extending over the whole periphery between an internal side face and the lower-side main surface are formed at a central section; ball-shaped terminals 5 mounted on the pads 3 and metal plates 6, which have projecting sections at the centers of the top faces of tabular sections and in which the top faces of the tabular sections in the peripheries of the projecting sections are joined with the undersides of the stepped sections A. In the wiring board, the top faces of the projecting sections of the metal plates 6 and the upper-side main surface of the insulating base body 1 are formed on the same plane, and the undersides of the metal plates 6 and the lower ends of the terminals 5 are formed in the same height. COPYRIGHT: (C)2005,JPO&NCIPI
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