发明名称 |
Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
摘要 |
An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of -10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same. |
申请公布号 |
US6838170(B2) |
申请公布日期 |
2005.01.04 |
申请号 |
US20030351430 |
申请日期 |
2003.01.27 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TANAKA YUKO;SHIMADA YASUSHI;INADA TEIICHI;KURIYA HIROYUKI;YAMAMOTO KAZUNORI;KUMASHIRO YASUSHI;SUMIYA KEIJI |
分类号 |
C08G59/34;C08G59/68;C08K5/00;C08L63/00;C09J7/02;C09J133/00;C09J133/06;C09J163/00;H01L21/52;H01L21/58;H01L23/14;H05K3/32;H05K3/34;(IPC1-7):B32B27/38 |
主分类号 |
C08G59/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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