发明名称 MULTI-LAYERED SUBSTRATE CONNECTION PIN FOR MDF TO ENLARGE SHRINKAGE RANGE AND ENHANCE ELASTIC FORCE AND A FABRICATING METHOD THEREOF
摘要 PURPOSE: A multi-layered substrate connection pin for MDF(Main Distributing Frame) and a fabricating method thereof are provided to enlarge shrinkage range and enhance elastic force, thereby preventing abrasion of conduction layer, which is formed on an inside wall of a through hole of the connection pin, and wiring patterns of the multi-layered substrate. CONSTITUTION: Connection terminals(2) for electrically connecting patterns of a multi-layered substrate are formed through press process. A connection pin(1) is formed by inserting the connection terminal in an injection metallic molding and filling and hardening liquefied plastic resin in the injection metallic molding. An inserting part(12) of the connection pin is incised in a longitudinal direction with a cutter, thereby forming a plurality of elastic supporting elements(121) and connection terminal elements in the inserting part.
申请公布号 KR20040110049(A) 申请公布日期 2004.12.29
申请号 KR20030040442 申请日期 2003.06.20
申请人 HUH, SANG ROK 发明人 HUH, SANG ROK
分类号 H01R43/00;(IPC1-7):H01R43/00 主分类号 H01R43/00
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