| 摘要 |
<P>PROBLEM TO BE SOLVED: To highly precisely manufacture a semiconductor device having external signal terminals by taking a noise countermeasure. <P>SOLUTION: The manufacturing method of the semiconductor device comprises the processes of: forming post terminals 13 and external signal terminals 15 which correspond to a plurality of semiconductor device, and ground terminals 17 which surround the external signal terminals 15 and have discriminable shapes against other terminals simultaneously on a plate member; arranging each semiconductor pellet 12 on the post terminals 13 in such a way that each ground terminal 17 is made to be a reference; integrally sealing it with resin in such a manner that lower end surfaces of all the terminals are exposed; and dividing it into a plurality of semiconductor devices by cutting a resin sealing body in such a way that an end surface of the each ground terminal 17 is made to be a reference. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
