Dummy-wafer for an oven process especially an oven process for layer separation where the front or rear side has an enhanced profile useful for layer separation in semiconductor technology

摘要

A dummy-wafer for an oven process especially an oven process for layer separation with a front side (VS) and a rear side (RS), where at least the front or rear side has an enhanced profile (1b;1'b;1''b;1'''b) to increase the bending strength compared with the corresponding plane side. An independent claim is included for a process for preparation of the wafer by pressing of SiC in a mold and/or polishing or grinding.