| 摘要 |
An apparatus for polishing a workpiece includes a workpiece holder 104 configured to hold the workpiece, a polishing member 102 configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen 600 having a plurality of pressure zones zl-z4 configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller 564 coupled to the platen and configured to selectively adjust the pressure zones zl-z4.
|
