发明名称 Multi-parameter process and control method
摘要 A method and system for generating control settings for a multi-parameter control system. The interdependencies of processing tools and the related effect on semiconductor wafers within a processing tool is factored into a mathematical model that considers desired and measured wafer quality parameters in the derivation of specific solutions of sets of possible quality parameter adjustments. A selection process determines a set of adjustments such as one that results in minimal changes to the process.
申请公布号 US2004173599(A1) 申请公布日期 2004.09.09
申请号 US20030378757 申请日期 2003.03.04
申请人 VELICHKO SERGEY A.;NELSON JEFFREY S.;EAGANS ROGER W. 发明人 VELICHKO SERGEY A.;NELSON JEFFREY S.;EAGANS ROGER W.
分类号 H01L21/00;(IPC1-7):H05B1/02 主分类号 H01L21/00
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