发明名称 |
Multi-parameter process and control method |
摘要 |
A method and system for generating control settings for a multi-parameter control system. The interdependencies of processing tools and the related effect on semiconductor wafers within a processing tool is factored into a mathematical model that considers desired and measured wafer quality parameters in the derivation of specific solutions of sets of possible quality parameter adjustments. A selection process determines a set of adjustments such as one that results in minimal changes to the process.
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申请公布号 |
US2004173599(A1) |
申请公布日期 |
2004.09.09 |
申请号 |
US20030378757 |
申请日期 |
2003.03.04 |
申请人 |
VELICHKO SERGEY A.;NELSON JEFFREY S.;EAGANS ROGER W. |
发明人 |
VELICHKO SERGEY A.;NELSON JEFFREY S.;EAGANS ROGER W. |
分类号 |
H01L21/00;(IPC1-7):H05B1/02 |
主分类号 |
H01L21/00 |
代理机构 |
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地址 |
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