METHOD FOR INTEGRATING A CHIP IN A PRINTED BOARD AND INTEGRATED CIRCUIT

摘要

The invention relates to a method for generating a highly integrated structure. To this end, a chip is embedded in a printed board by thinning the back of said chip, applying it to a base layer of the printed board and covering it by another printed board layer. Recesses are produced in said printed board layer that extend up to a conductor structure of the base layer of the printed board and to connection surfaces of the chip. Contact is established via a contact conductor structure (10) that extends to the connection surface (3) of the chip and the conductor structure (6) of the base layer of the printed board. This method is repeated layer by layer to give multilayer three-dimensional structures.