| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small-sized and high-performance system-in-package (SiP) suitable for a high-density mounting. <P>SOLUTION: The system-in-package (SiP) has a stack structure in which two memory chips 2A, 2B are stacked on the main surface of a wiring board 1 to be mounted, further a microcomputer chip 2C is stacked thereon to be mounted, and these chips are sealed with a mold resin 3. Each of the memory chips 2A, 2B is arranged so as to exchange data with an external unit of a system through the microcomputer chip 2C. As the microcomputer chip 2C is constituted of a multi-port structure equipped with various interfaces with the external unit of the system in addition to the interface with the inside of the system, the number of terminals (pins) is much more than the memory chips 2A, 2B. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
