| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a low dielectric constant polyimide substrate having high heat resistance which maintains the character of a high heat resistant polyimide film, and also in which a low dielectric constant fluororesin film is laminated to a polyimide film substrate with a large peel strength. <P>SOLUTION: The method for manufacturing the low dielectric constant polyimide substrate is to laminate a thermo-compression bonding multi-layer polyimide film including a thermo-compression bonding aromatic polyimide layer having a thickness of 0.5μm or more and a thickness of 50% or less of an entire polyimide layer to at least one side of a high heat resistant aromatic polyimide layer, and a fluororesin film by heating and pressurizing through a thermo-compression bonding aromatic polyimide layer surface which is carried out vacuum plasma discharge treatment under the presence of an organic fluorocompound; and is to have a peel strength of 0.8 kg/cm or more by that the thermo-compression bonding multi-layer polyimide film and the fluororesin film are laminated by heating and pressurizing through the thermo-compression bonding aromatic polyimide layer surface which is subjected to the vacuum plasma discharge treatment. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
