| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin seal molding method for an electronic component which enhances the productivity of a product by efficiently preventing product defects such as voids, the unfilling or the like of a product by using a resin material uniformly pressed to a mold for the seal molding of a resin in the manufacturing of a substrate having a plurality of semiconductor chips being electronic components mounted thereon, and an apparatus therefor. <P>SOLUTION: A uniformly pressed granular resin 14 is supplied to a mold cavity forming part 6 almost simultaneously with the sliding and opening of an on-off part 20 in a resin supply mechanism 7 in a horizontal direction in such a state that the granular resin 14 is uniformly pressed by a pressure means 21 at the time of opening of the mold. Accordingly, heat can be uniformly transferred to the whole of the resin from the contact surface of the granular resin 14 with the bottom surface of the mold cavity forming part 6 to the surface of the granular resin and the voids in a molten resin 15 can be efficiently prevented without causing a temperature difference in the granular resin 14. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
