| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device, the entire of which is made thinner for improved light emission efficiency by surely flip-chip mounting a semiconductor light emitting element. <P>SOLUTION: In the semiconductor light-emitting device 1, a light emitting layer 5 comprises a translucent crystal substrate 12 with its front surface (top surface) serving as a light taking-out side and its rear surface having a light emitting layer laminated with a semiconductor film. Electrodes 6 and 7 formed on the rear surface side are jointed to lead electrodes 3 and 4 formed on a lead substrate 2 through bumps 8 and 9. The gap between them is sealed with a sealing material 13. Thus, the light emitting element 5 is mounted on the lead substrate 3 to provide a semiconductor light emitting device 1. The sealing material 13 seals the light emitting element 5 at least with the main part (top surface or the like) 14 of the light taking-out surface left exposed. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
