MODULE WITH ENCAPSULATION

摘要

The invention particularly relates to a high frequency module, in particular a microwave or millimetre wave module and the housing technology for such components. The high frequency module comprises for example, a) an active individual component, comprising in particular, a diode, a transistor and an integrated circuit and b) a substrate of multi-layer embodiment and integrated circuit elements, whereby the individual components are arranged on the upper side of the substrate. According to the invention, a film cover is used to protect the high frequency individual components.