| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is obtained by laminating semiconductor chips, which is not restricted by a chip size, which uses a wire bonding and which is short in height. SOLUTION: First and second semiconductor chips 2a and 2b are laminated in order on a substrate 1, and electrodes on the respective semiconductor chips 2a and 2b and an electrode on the substrate are connected by wire bonding. A space between first and second semiconductor chips 2a and 2b is filled with an insulating adhesive 4, and a first wire 3a to be connected to the upper surface of the first semiconductor chip 2a on a lower side is crushed by the lower surface of the second semiconductor chip 2b. COPYRIGHT: (C)2004,JPO&NCIPI |
