发明名称 MODULAR JACK
摘要 PROBLEM TO BE SOLVED: To provide a modular jack which can be assembled easily and can be constructed in a small size. SOLUTION: A first terminal block 3 having a first terminal 2 with which the terminal of a plug come into contact is combined with a housing 1. The first terminal 2 is exposed to the inner hollow part 1e of the housing 1, and its rear end protrudes backward of the block 3. A second terminal block 5 has a second terminal 4 which is connected to a mother board to which a modular jack is fitted. Electronic components 7a, 7c are mounted on a built-in substrate 6. The built-in substrate 6 has terminals 6a, 6b of a through-hole shape or a terminal of cut-out shape to which the first terminal 2 and the second terminal 4 are soldered. A coil terminal 8 of a coil component is inserted into through-holes 6c, 6d of the built-in substrate 6 and soldered. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004186099(A) 申请公布日期 2004.07.02
申请号 JP20020354461 申请日期 2002.12.06
申请人 TDK CORP 发明人 SASAI HIROSHI;KINOSHITA KAZU;YASUDA MITSUTAKA;FUKUDA TADASHI
分类号 H01R13/33;H01R13/66;H01R13/719;H01R24/00;H01R107/00;(IPC1-7):H01R13/66 主分类号 H01R13/33
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