| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form a solder ball by a low price apparatus of simplified structure for a semiconductor device such as CSP. <P>SOLUTION: A flux 14 is coated by a screen printing method on a columnar electrode 8 on a silicon substrate 1 in a wafer state. Next, a printed mask 15 is allocated at the rather upper part of the flux 14 coated on the columnar electrode 8. A number of solder balls 10 are supplied to predetermined areas on the printed mask 15. While, a squeegee 17 is moved in the predetermined direction to the rather upper part upper than the upper surface of the printed mask 15, air is blown rather weakly as indicated by an arrow mark from an air blowing port 18. Consequently, the solder balls 10 are arranged one by one on the flux 14 within each aperture 16 of the printed mask 15. Since the arrangement method of such solder balls is a kind of the screen printing method, such solder balls can be formed by the low price apparatus of the simplified structure. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
