发明名称 |
Adhesive film for underfill and semiconductor device using the same |
摘要 |
An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.
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申请公布号 |
US2004096633(A1) |
申请公布日期 |
2004.05.20 |
申请号 |
US20030704905 |
申请日期 |
2003.11.12 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MATSUMURA AKIKO;UWADA KAZUKI;SADAYORI NAOKI;HOTTA YUJI |
分类号 |
C08G18/02;C08G73/00;C09J7/00;C09J179/00;H01L21/56;H01L23/29;(IPC1-7):B32B3/00 |
主分类号 |
C08G18/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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