| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board in which a circuit is mapped on a forming body using a resin composition in which a fine circuit of a desired thickness can easily be mapped at low cost. SOLUTION: The circuit board has a resin forming body containing metal powders having a removable insulating film on the surface, and a metal wiring formed with a metal deposited by a plating process with an insulating film removable metal particle in a pattern etched by laser beam irradiation to the resin forming body as a seed. Further, in a method for manufacturing the circuit board, the resin forming body is manufactured by using the metal powder having the removable insulating film on the surface and the resin composition composed of a resin to be processed with laser beams and next, the resin forming body is irradiated with the laser beams to etch a desired pattern. After the insulating film of the metal powder in the formed pattern is selectively removed, a metal is grown by deposition with the metal powder obtained by removing the insulating film by the plating process as the seed, to form the metal wiring. Then, it is possible to form the circuit board which is hard to short-circuit and has the high adhesion with respect to a resin board. COPYRIGHT: (C)2004,JPO
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