LOW-DIELECTRIC-CONSTANT MATERIAL, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To disclose low-dielectric-constant materials, the improvements of the performances of the films including the same materials, and the manufacturing methods thereof when they are used as interlayer dielectrics in integrated circuits.

SOLUTION: These materials are characterized in that their dielectric constants (k) are equal to or smaller than about 3.7, and the standardized wall elastic moduluses (E0') are equal to or larger than about 15 GPa which are derived partially from the dielectric constants of the foregoing materials, and their metal-impurity levels are equal to or smaller than 500 ppm. Also, there are given low-dielectric-constant materials having dielectric constants smaller than about 1.95 and having standardized wall elastic moduluses (E0') larger than about 26 GPa which are derived partially from the dielectric constants of the foregoing materials.

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