发明名称 |
Low application temperature hot melt adhesive |
摘要 |
A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0x10<7 >dynes/cm<2 >at 10 rads/sec (25° C.).
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申请公布号 |
US2004077240(A1) |
申请公布日期 |
2004.04.22 |
申请号 |
US20020273836 |
申请日期 |
2002.10.18 |
申请人 |
PAUL CHARLES W.;SHARAK MATTHEW L.;RYAN LEISA A.;XENIDOU MARIA;HARWELL MICHAEL G.;HE QIWEI |
发明人 |
PAUL CHARLES W.;SHARAK MATTHEW L.;RYAN LEISA A.;XENIDOU MARIA;HARWELL MICHAEL G.;HE QIWEI |
分类号 |
C09J153/02;(IPC1-7):C09J1/00;B32B5/02 |
主分类号 |
C09J153/02 |
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