发明名称 MULTILAYER PRINTED BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed board by which the reducing effect of noise influence is improved without mounting a noise-countermeasure component. <P>SOLUTION: By laminating a plurality of resin films 23 and 21 including a conductor pattern film 21 consisting of a thermoplastic resin and pressurizing them while heating, the films 23 and 21 are pasted to each other and multilayered. The multilayer printed board obtained like this is provided with an element layer 41 functioning as a noise absorber on the side of the inner layer of the plurally laminated resin film, a ground layer 22g formed in the laminating direction of the element layer 41 and consisting of a conductor pattern 22, a noise conductor part 46 connected electrically with the element layer 41 for guiding noise, and a shielding part 70 consisting of the plurally laminated resin films forming a board area in the neighborhood of the noise conductor part 46. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004111566(A) 申请公布日期 2004.04.08
申请号 JP20020270551 申请日期 2002.09.17
申请人 DENSO CORP 发明人 SHIMODAIRA TOSHIYA;IOKA ISAO
分类号 H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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