| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin which exhibits good moldability and curability and can obtain a cured product having excellent heat resistance, particularly when used as a semiconductor packaging material, and its manufacturing method. SOLUTION: The epoxy resin has a repeating unit to be represented by formula (I) in the molecule, and preferably has a weight average molecular weight of 500-5,000. COPYRIGHT: (C)2004,JPO
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