发明名称 SURFACE CONDUCTIVE COMPOUND PLASTIC SHEET AND VESSEL FOR ELECTRONIC PARTS TRANSFER
摘要 PROBLEM TO BE SOLVED: To provide a surface conductive compound plastic sheet suitable for molding embossed carrier tapes superior in pocket strength and moldability. SOLUTION: On one face or both faces of a sheet substrate layer consisting of at least one kind of thermoplastic resin selected from polyethylene resin or ABS resin, or consisting of polymer alloys of these, this plastic sheet is formed by laminating surface conductive layers which have 1-50 pts.wt. of carbon black to 100 pts.wt. of thermoplastic resin composed of 100-80 pts.wt. of polycarbonate resin and 0-20 pts.wt. of polyester resin or/and 0-20 pts.wt. of ABS resin, and whose surface resistance value is 10<SP>2</SP>to 10<SP>10</SP>Ω/Square. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004087370(A) 申请公布日期 2004.03.18
申请号 JP20020248619 申请日期 2002.08.28
申请人 SUMITOMO BAKELITE CO LTD 发明人 ISHIDA YUSUKE
分类号 B65D73/02;B32B27/00;B65D65/40;B65D85/86;H01B5/14;(IPC1-7):H01B5/14 主分类号 B65D73/02
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