| 发明名称 |
EPOXY RESIN COMPOSITION AND PREPREG |
| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin and a prepreg stably storable for≥30 days at room temperature and having low-temperature curability and quick curability. SOLUTION: The one-pack type epoxy resin composition has a T<SB>90</SB>[110°C] (time from the start of curing to the state having a curing degree of 90% at 110°C) of 1-10 min. The epoxy resin composition contains (A) an epoxy resin, (B) a latent curing agent activating at 70-125°C and (C) a curing agent having a melting point of 100-200°C and a particle diameter of 2-20μm. COPYRIGHT: (C)2004,JPO
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| 申请公布号 |
JP2004075914(A) |
申请公布日期 |
2004.03.11 |
| 申请号 |
JP20020240248 |
申请日期 |
2002.08.21 |
| 申请人 |
TORAY IND INC |
发明人 |
NAKAHARA KOYOMI;TOMIOKA NOBUYUKI;OKITA HIDEKI |
| 分类号 |
C08J5/24;C08G59/40;(IPC1-7):C08G59/40 |
主分类号 |
C08J5/24 |
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