| 摘要 |
PROBLEM TO BE SOLVED: To provide a probing apparatus which has improved positioning accuracy by eliminating positioning error in the X, Y andθdirections of wafer when it is moved in the direction of Z-axis. SOLUTION: The probing apparatus comprises stages 2, 3, 4 which include a chuck 5 to hold the wafer W and may be moved in the X, Y, Z directions, an optical device for probing 7 which is mounted on the stages to measure height of the end point of a stylus 61 of a probing card 6, and an alignment optical device 8 for positioning the wafer. This alignment optical device can be moved upward and downward with a lifting mechanism 81. Accordingly, the position of the end point of the stylus can be adjusted to the equal height of the focusing point of the alignment optical device. COPYRIGHT: (C)2004,JPO
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