Thermosiphon for electronics cooling with nonuniform airflow

摘要

A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.