发明名称 Method and apparatus for producing electrolytic copper foil
摘要 An electrolytic copper foil is electrodeposited onto the cathodic drum surface of a rotating cathode drum by feeding an electrolytic solution between the cathode drum and an anode facing each other and applying direct current between them, while the initial formation of the crystal nuclei of the electrolytic copper foil is performed by providing an auxiliary anode, an electrolytic solution receiver and a flashboard above the anode and applying an electric current between the cathode drum and the auxiliary anode and feeding an electrolytic solution separately onto the cathodic drum surface from an electrolytic solution feeder placed near the auxiliary anode and discharging it through the gap between the cathodic drum surface and the edge of the electrolytic solution receiver, keeping an electrolytic solution holdup between the cathodic drum surface and the auxiliary anode by the electrolytic solution receiver and the flashboard.
申请公布号 US6663758(B2) 申请公布日期 2003.12.16
申请号 US20010849221 申请日期 2001.05.07
申请人 NIPPON DENKAI, LTD. 发明人 MOTOHASHI SHIGETADA;AMAKATA MASASHI
分类号 C25D1/04;(IPC1-7):C25D1/04;C25C1/12;C25D17/00;C25D21/12 主分类号 C25D1/04
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