| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for effectively dissipating heat generated from a semiconductor element in the case that the semiconductor element is mounted on a substrate by using a flip chip method and packaged. SOLUTION: In the method for manufacturing a semiconductor device, a columnar structure which is composed of a metal and penetrates an adhesive agent layer exists in the adhesive agent layer and is brought into contact with the semiconductor element or a sealing resin when a heat dissipating plate formed of metal is fixed, in a semiconductor device wherein the heat dissipating plate is fixed on the semiconductor element or the sealing resin by using an adhesive agent. It is preferable that the columnar structure is formed previously by using any one method out of a die casting method, an etching method and a plating method. COPYRIGHT: (C)2004,JPO
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