| 摘要 |
An apparatus (100) in one example includes a compliant component (104, 106, 108, 110, 112, 114, 116, 118) for supporting an electrical interface component (120, 122, 124, 126, 128, 130, 132, 134) that serves to electrically and mechanically couple a die (102) with a separate layer. In one example, the compliant component, (104, 106, 108, 110, 112, 114, 116, 118) upon relative movement between the die (102) and the separate layer, serves to promote a decrease in stress in one or more of the die and the separate layer. The apparatus (100) in another example includes a compliant component (104, 106, 108, 110, 112, 114, 116, 118) for supporting an electrical interface component (120, 122, 124, 126, 128, 130, 132, 134) that serves to create an electrical connection between a die (102) and a separate layer. The compliant component (104, 106, 108, 110, 112, 114, 116, 118), upon relative movement between the die (102) and the separate layer, serves to promote maintenance of the electrical connection. |
