| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a manufacturing process is long and an yield is unfavorable in a semiconductor package base board prepared by an etch-back method. SOLUTION: A semiconductor package of the semiconductor package base board is manufactured by laying up a one-side base board with a dump and applying electrolytic nickel plating, then, etching copper foil while employing an outer terminal as an etching mask, whereby the semiconductor package base board manufactured inexpensively and having stabilized bonding characteristics and excellent high-frequency characteristics is provided. COPYRIGHT: (C)2004,JPO
|
