| 摘要 |
A support (10) of the printed circuit type, also called "chip carrier", for use in the making of electronic components (50), which comprises a sheet (13) of electrically insulating material, and which has, on one side (10a), a first plurality of cells or small areas (27), each of which is provided with solder pads or mounting areas (26) for receiving and electrically connecting to a corresponding integrated electronic circuit (41), and, on the other side (10b), a second plurality of cells provided with solder pads or mounting areas (26) for the coupling of the carrier (10) with a common electronic board (48); wherein a protective layer (28) is deposited on both sides (10a, 10b) of the carrier (10) in such a way as to leave uncovered the relative mounting areas (26), and wherein the carrier (10) also has, along the outlines of the cells (27), a plurality of etchings (33) which pass through the protective layer (28) to leave uncovered the layer (13) of insulating material underneath, and which correspond to removed portions (25a) of an original conducting grid (25), used during the manufacturing process of the carrier (10) itself to deposit a thin layer of solderable material (32) on the various pads or mounting areas (26). The carrier (10), thanks to the removal of these portions (25a) of the original conducting grid (25), acquires a structure which electrically insulates the various cells (27) from one another, so that the carrier (10) may be tested advantageously together with the integrated electronic circuits (41) mounted thereon, before the stage in which the carrier (10) is divided into electronic components (50), thereby avoiding the much more costly testing of the single electronic components (50), piece by piece. |
